WDS-620 Semi Automatic BGA Rework Station with ±0.01mm Placement Accuracy 5200W Power and Infrared Hot Air Heating

Product Description:

The Semi Automatic BGA Rework Station is a highly efficient and reliable tool designed specifically for the precise repair and replacement of Ball Grid Array (BGA) components on printed circuit boards (PCBs). Engineered to meet the demanding needs of modern electronic repair and manufacturing, this rework station offers exceptional performance with a range of advanced features tailored for both professional technicians and production environments. With its semi-automatic placement mode, the machine strikes a perfect balance between manual control and automated precision, making it an ideal choice for intricate rework tasks such as CPU repair and other BGA component maintenance.

One of the standout features of this BGA rework station is its powerful 5200W power consumption capability, which ensures rapid heating and efficient operation. The hot air heating system is designed to provide uniform and controlled heat distribution, essential for safely removing and reflowing BGA chips without damaging the delicate PCB or surrounding components. This precise thermal control minimizes the risk of thermal shock and enhances the overall quality of the repair job, making it particularly suitable for high-value components like CPUs.

The placement accuracy of this semi-automatic BGA rework station is an impressive ±0.01mm, which guarantees extremely precise alignment of BGA components during the repair process. Such high accuracy is crucial when dealing with densely packed and complex circuit boards where even minute misalignments can lead to faulty connections or component failures. The machine incorporates an advanced optical alignment system that greatly simplifies the positioning process by providing clear, magnified visuals and alignment guides, thereby reducing operator errors and improving repair success rates.

Designed to handle BGA sizes up to a maximum of 80x80mm, this rework station is versatile enough to accommodate a wide range of components commonly found in modern electronics. Whether you are repairing small ICs or larger chips, the station’s adjustable settings and semi-automatic operation allow for flexible handling and precise placement, making it a valuable tool in electronics workshops and manufacturing lines.

Powering this sophisticated equipment is a dual-voltage power supply option of 220V/110V, ensuring compatibility with various electrical standards worldwide. This feature makes the Semi Automatic BGA Rework Station suitable for use in different geographic locations without the need for additional adapters or converters, enhancing its usability and convenience for global users.

Overall, this Semi Automatic BGA Rework Station is an indispensable tool for anyone involved in the repair or assembly of electronic devices. Its combination of a semi-automatic placement mode, high power consumption for efficient hot air heating, exceptional placement accuracy, and an integrated optical alignment system makes it a comprehensive solution for CPU repair and other BGA-related tasks. Whether you are a professional technician or part of a production team, this rework station offers the precision, reliability, and versatility needed to achieve high-quality results consistently.

In conclusion, the Semi Automatic BGA Rework Station stands out as a state-of-the-art device that enhances the efficiency and accuracy of BGA repairs. Its robust features, including the powerful 5200W heating system, ±0.01mm placement accuracy, and the advanced optical alignment system, make it a top choice for demanding electronic repair applications. Coupled with its capacity to handle BGA sizes up to 80x80mm and its adaptable 220V/110V power supply, this rework station is engineered to deliver superior performance and reliability in any electronics repair setting.

Features:

• Product Name: Semi Automatic BGA Rework Station
• Heating Method: Infrared + Hot Air for efficient and uniform heating
• PCB Thickness Compatibility: Supports 0.3-5mm thickness
• Maximum BGA Size: Accommodates BGA components up to 80x80mm
• Weight: Approx. 55kg for stable operation
• Placement Mode: Semi Automatic for precise and easy component placement
• Includes an Infrared preheating table to enhance motherboard repair efficiency
• Ideal for professional motherboard repair and rework tasks

Technical Parameters:

Applications:

The WDS620 Semi Automatic BGA Rework Station by WDS is an advanced and reliable solution designed for precise and efficient soldering and rework tasks on Ball Grid Array (BGA) components. Originating from China and certified with CE, this product ensures high quality and safety standards. Its semi automatic operation mode, combined with a high placement accuracy of ±0.01mm, makes it an ideal choice for electronics manufacturers, repair shops, and research laboratories that require meticulous and repeatable BGA rework processes.

This BGA rework station is equipped with a three heating zone system, allowing for uniform and controlled heating during the reflow soldering process. This feature is crucial for preventing thermal damage to sensitive components and ensuring the integrity of the PCB and solder joints. With a maximum PCB size capacity of 470x380mm and handling PCB thickness ranging from 0.3mm to 5mm, the WDS620 accommodates a wide variety of circuit boards, making it versatile for different product lines and applications.

Due to its semi automatic placement mode, the WDS620 offers a balance between manual control and automated precision, making it suitable for both skilled technicians and production environments that require flexibility. The weight of approximately 55kg and packaging in a sturdy wooden case facilitates safe transportation and installation in various workplaces. With a supply ability of 200 units and a delivery time of 3-5 days, businesses can efficiently integrate this BGA rework station into their workflows.

The WDS620 is particularly useful in scenarios such as electronic device repair centers, prototype development, small to medium scale production lines, and quality control labs. It excels in handling tasks like chip replacement, solder joint repair, and component testing where precision and reliability are paramount. The semi automatic operation enables operators to achieve consistent results while maintaining control over the rework process.

Payment terms are flexible with T/T accepted, making procurement straightforward. Overall, the WDS Semi Automatic BGA Rework Station model WDS620 is a powerful tool that meets the demands of modern electronics manufacturing and repair, providing efficient, accurate, and safe BGA rework solutions.

Customization:

Introducing the WDS Semi Automatic BGA Rework Station, model WDS620, a premium product originating from CHINA with CE certification. This advanced BGA rework station features an infrared preheating table and a three heating zone design, ensuring precise and efficient repair of BGA components.

The WDS620 supports PCB thickness ranging from 0.3mm to 5mm and operates with a powerful 5200W power consumption, compatible with 220V/110V power supply. Its heating method combines infrared and hot air technology for superior thermal control.

Measuring L800 x W780 x H810mm, this BGA rework station is packaged securely in a wooden case to ensure safe delivery. With a supply ability of 200 units, WDS guarantees a minimum order quantity of just 1 unit, with a delivery time of 3-5 days and payment terms via TT.

Customize your product with WDS for reliable, efficient, and precise BGA rework solutions featuring the infrared preheating table and three heating zone technology.

Support and Services:

The Semi Automatic BGA Rework Station is designed for precise and efficient soldering and desoldering of Ball Grid Array (BGA) components on printed circuit boards (PCBs). This advanced rework station combines user-friendly semi-automatic operation with high accuracy and reliability, ensuring optimal results for electronic repair and manufacturing applications.

Our technical support team is dedicated to assisting you with installation, operation, and troubleshooting of the Semi Automatic BGA Rework Station. Comprehensive user manuals and tutorial videos are available to guide you through the setup process and to help you master the rework procedures.

Key features supported include temperature control, alignment assistance, and programmable heating profiles tailored for various BGA package types. Regular software updates and firmware upgrades are provided to enhance functionality and maintain compatibility with the latest BGA components.

We offer maintenance services and calibration support to ensure your rework station operates at peak performance. Our service technicians are trained to perform repairs, replace parts, and conduct preventive maintenance to minimize downtime and extend the lifespan of your equipment.

For optimal use of the Semi Automatic BGA Rework Station, we recommend following the provided guidelines for handling delicate components and using recommended consumables. Our support resources include FAQs, troubleshooting guides, and expert advice to resolve common issues quickly and effectively.

Packing and Shipping:

Product Packaging:

The Semi Automatic BGA Rework Station is securely packaged in a sturdy, high-quality cardboard box designed to protect the equipment during transit. Inside the box, the station is cushioned with foam inserts to prevent any movement or damage. All accessories, including the soldering iron, hot air gun, power cables, and user manual, are neatly organized and packed separately within the box. The packaging also includes anti-static bags to safeguard sensitive electronic components from static electricity.

Shipping:

We offer reliable and fast shipping options worldwide. The Semi Automatic BGA Rework Station is shipped via trusted courier services with tracking available for all shipments. Each package is carefully handled to ensure the product arrives in perfect condition. Shipping costs and delivery times vary depending on the destination and selected shipping method. Customers will receive a confirmation email with tracking details once the order has been dispatched.

FAQ:

Q1: What is the brand and model number of this Semi Automatic BGA Rework Station?

A1: The brand name is WDS and the model number is WDS620.

Q2: Where is the WDS620 Semi Automatic BGA Rework Station manufactured?

A2: This product is made in China.

Q3: Does the WDS620 BGA Rework Station have any certifications?

A3: Yes, it is CE certified.

Q4: What is the minimum order quantity for the WDS620 BGA Rework Station?

A4: The minimum order quantity is 1 unit.

Q5: How is the WDS620 BGA Rework Station packaged and what is the delivery time?

A5: It is packaged in a wooden case and the delivery time is typically 3-5 days.

Q6: What are the payment terms and supply ability for this product?

A6: The payment terms are TT (Telegraphic Transfer), and the supply ability is 200 units.